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C. B. Okpanachi

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Open access Sep 2026

Thermal Conductivity and Degradation Kinetics of Copper Nanoparticle-Reinforced Polypropylene Composites: Towards Thermally Enhanced Active Food Packaging

This study investigates the thermal conductivity and degradation kinetics of copper nanoparticle (Cu NP) reinforced polypropylene (PP) composites as potential materials for thermally enhanced food-packaging applications. Cu NP–PP nanocomposites were prepared by twin-screw extrusion at 0, 1, 2, 5, and 10 wt% Cu NP. Ther...

D. Zakari, G. Audu, A. Aliyu et al. · 0 citations

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