Chengqiang Cui

Machine Learning-Assisted Numerical Investigation on Multiphysics Coupling for Copper Electroplating in High-Aspect-Ratio Through-Glass Vias

Through-glass vias (TGVs) are key structures for high-density vertical interconnection in three-dimensional advanced packaging. The quality of copper electroplating filling of TGVs directly affects the electrical performance, thermal stability, and service reliability of interconnect structures. Conventional finite ele...