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Author

F. Jenot

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Open access Sep 2026

Non-Contact Evaluation of Film Electroadhesion using Laser Ultrasonics and SAWs

Film adhesion is a critical phenomenon that has been thoroughly investigated to improve structural reliability, notably in microelectronics. In this work, Laser Ultrasonics is used to evaluate the bond quality achieved by an original electroadhesion process. More precisely, an electrostatic field is applied to a polyvi...

Meriem Chrifi Alaoui, M. Baher, F. Jenot et al. · 0 citations

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