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G. K. Nandasiri

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Conference Aug 2026

Numerical Simulation of Heat Transfer and Mechanical Stress in Microencapsulated Phase Change Materials for Wearable Textile Applications

This paper presents a finite element simulation study of microencapsulated phase change materials (MPCMs) developed for integration into wearable thermoregulating textiles. Using COMSOL Multiphysics 6.2, heat transfer and mechanical stress analyses were conducted on n-octadecane/melamine-formaldehyde (MF) microcapsules...

Kulith T. Ranasinghe, I. D. Nissanka, G. K. Nandasiri · 0 citations

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