Molecular Dynamics Simulation: Comparative Investigation of Nanoscale CuAl2 and Fe Interlayers for Interfacial Strengthening–Toughening of Cu/Al Laminated Composites
The brittle nature of CuAl2 intermetallic layers severely limits the service reliability of Cu/Al clad materials in power electronics. Here, molecular dynamics simulations are performed to clarify the thickness-dependent deformation behavior of CuAl2 interlayers (0–40 Å) and to propose a ductile Fe interlayer modificat...