Hao-Ting Niu

Tough Hydrogel-Mediated Constrained Assembly of Multidimensional Topological Networks for Synergistic Mechanical-Thermal Enhancement.

The rapid development of high-power flexible electronics demands thermal management materials with both high thermal conductivity and mechanical robustness. However, traditional high-loading thermal management materials suffer from an intrinsic mechanical-thermal trade-off. Herein, we propose a tough hydrogel-mediated...