As NA 0.33 EUV lithography operates increasingly close to fundamental resolution limits, accurate and robust optical proximity correction (OPC) models become critical for advanced logic technology development. In early technology phases, OPC calibration is challenged by limited availability of real product layouts. To...
As advanced techniques in Optical Proximity Correction (OPC), such as curvilinear OPC and inverse lithography technology, gain traction in production flows, the accuracy and robustness of compact OPC models become increasingly critical for advanced technology nodes. Traditional mask modeling approaches typically infer...
W. Gillijns, Ren-Yang Meng, B. Baskaran et al.· Photomask Japan· 1 citation
Curvilinear EUV mask layouts challenge conventional qualification because local geometry changes continuously along the contour. Sparse CD-style sampling can therefore miss or average out the regions that drive the measured response. We present a contour-based evaluation workflow using PMsite outputs and mask SEM data...
B. Baskaran, J. Bekaert, K. Miyaguchi et al.· Photomask Japan· 0 citations
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