Jinyan Wang

Tailoring Backbone Rigidity and Cross-Linking of Photosensitive Polyimides for 3D Printing with Ultralow Dielectric Loss at High Frequencies

Additive manufacturing represents a versatile platform for the development of high-frequency communication electronics. However, existing dielectric polymer inks often fail to simultaneously meet the requirements of low dielectric loss, high thermal stability, and high mechanical robustness. In this work, a photosens...