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Jooheon Kim

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Sep 2026

Dual-Layer Microencapsulated Phase Change Material Composite with Enthalpy-Active Shell for Thermal Absorption and Directional Heat Management

Localized heat accumulation in electronic devices degrades performance, safety, and cycle life. Phase change materials (PCMs) have been widely investigated for passive thermal regulation; however, conventional core–shell encapsulated PCMs often exhibit limited effective heat absorption because shell materials remain...

Junho Kim, Min Park, Sangwoo Kim et al. · 0 citations

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