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Author

Ken Vielmette

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Oct 2026

Automated Scanning Acoustic Microscopy for Package-Level Defect Screening of QFN Devices

Semiconductor packages are widely used across aerospace, automotive, military/government, and consumer electronics applications. In high-reliability environments that demand long-term performance under harsh operating conditions, standard commercial manufacturing controls are often insufficient, necessitating additio...

Rachael Gitnes, Ken Vielmette, Talapker Imanbayev et al. · 0 citations

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