Kulith T. Ranasinghe

Numerical Simulation of Heat Transfer and Mechanical Stress in Microencapsulated Phase Change Materials for Wearable Textile Applications

This paper presents a finite element simulation study of microencapsulated phase change materials (MPCMs) developed for integration into wearable thermoregulating textiles. Using COMSOL Multiphysics 6.2, heat transfer and mechanical stress analyses were conducted on n-octadecane/melamine-formaldehyde (MF) microcapsules...