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Marianna Lintzeri

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Conference Sep 2026

Which Parameter Matters Most? A Structured Literature Review and Unified Simulation Comparison of Design and Material Influences on PCBA Solder-Joint Lifetime

This paper presents a condition-controlled, simulation-based ranking of five key design and material parameters governing solder-joint fatigue life in printed circuit board assemblies (PCBAs) under thermal cycling: substrate material, substrate thickness, copper thickness, solder alloy, and solder thickness. All parame...

Maurice Artelt, Marianna Lintzeri, Matthias Weiss et al. · 1 citation

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