Phuong Trang Nguyen Thi

ENHANCING PROCESS EFFICIENCY AND COST SAVING IN BAG-AND-SEAL PROCESS USING A DMAIC APPROACH: A CASE STUDY IN SEMICONDUCTOR MANUFACTURING FACTORY

The Bag and Seal (BNS) process protects moisture-sensitive substrates before chip attach. In the current method, substrates are moved from liquid crystal polymer (LCP) tray to thermal form tray (TFT) for sealing and then returned to LCP trays, which requires ACL tools and leads to TFT deformation, long cycle time, and...