Quan-Zhou Yao

Toward Intelligent Chemical Mechanical Polishing: Integrating Multiscale Modeling and Machine Learning

Chemical mechanical polishing (CMP) remains the cornerstone planarization technology in advanced semiconductor manufacturing. As device architectures transition toward FinFETs, gate-all-around structures, heterogeneous integration, and wide-bandgap semiconductors, CMP must simultaneously deliver angstrom-level flatness...