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S. Riecker

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Oct 2026

Screen-Printed Sacrificial Structures For High-Thermal-Conductivity Copper-Diamond Heat Sinks

High-power electronic systems increasingly require thermal management solutions that combine superior heat transport with application-specific cooling geometries. This work presents a manufacturing concept for producing complex Cu-diamond heat sinks with thermal conductivities up to 650 W|(m·K). The approach combines a...

T. Hutsch, S. Riecker, Kay Reuter et al. · 0 citations

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