Sep 2026
Optimization of Hybrid Silica Composition in Polyimide Composite Films for Balanced Processability and High‐Frequency Dielectric Performance
Hybrid silica‐filled polyimide (PI) composites were developed for low‐dielectric copper‐clad laminate (CCL) applications by systematically varying the hollow‐silica‐to‐nano‐silica ratio while maintaining a constant total silica content. The influence of hybrid filler composition on bulk rheological behavior, film‐for...
S. O. Kim, Jae Myeong Lee, Suin Chae et al.
· Polymer Engineering & Sc... · 0 citations