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Shi-Qi Yang

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Open access 2026

Wafer Bonding Defect Detection With Coded Ultrasound Array Imaging and Fourier Domain Analysis

The continuous drive for miniaturization and 3D integration in the semiconductor industry necessitates uncompromising quality in wafer bonding. Scanning Acoustic Microscopy (SAM) is a benchmark for detecting micron-scale bonding defects, but its point-by-point scanning mechanism imposes a throughput bottleneck, renderi...

Bingze Dai, Yang Leng, Shi-Qi Yang et al. · 0 citations

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