Author

Si-Yu He

2 papers indexed here

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Conference Aug 2026

Mechanism-Driven Deep Learning for Predicting the Impact of Hard Impurity Particles on Direct Wafer Bonding Performance

Direct wafer bonding is a foundational technology for fabricating micro-electro-mechanical systems (MEMS) and achieving high-density multifunctional chip integration. However, the presence of environmental impurity particles at the bonding interface remains a critical challenge. While traditional evaluation methods rel...

Fei-Xiang Tang, Qian-Yu Shu, Si-Yu He et al. · International Conference on... · 0 citations

Aug 2026

Mechanical behavior of Cu–Ni functionally graded material-faced sandwich structures: A molecular dynamics study

To investigate the atomistic mechanical behavior of Cu–Ni functionally graded sandwich structures, molecular dynamics simulations were performed on models with Cu–Ni graded face sheets and a homogeneous Ni core. Tensile and compressive responses were examined at 220, 300, and 420 K for three thickness ratios (1:1:1, 1:...

Yuxuan Fu, Feixiang Tang, Xinyu Wu et al. · Journal of Applied Physics · 0 citations