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Author

Uma Chirkova

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Open access Aug 2026

Scalable, Simple, and Versatile Encapsulation of 2D Materials and Devices

Air-sensitive 2D materials present fundamental challenges for device integration. Encapsulation is required to preserve intrinsic properties, yet conventional strategies require complicated fabrication workflows and fail with thicker flakes. We demonstrate that electron-beam (e-beam) evaporated aluminum oxide (AlO x )...

Gabriel Natale, Uma Chirkova, F. Feres et al. · 0 citations

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