Physics-Guided FE Surrogate CDNN With Grouped Attention and Monotonicity Constraints for Solder Joint Thermal Fatigue Life Prediction
The prediction of thermal fatigue life for solder joints is a key aspect of reliability design in electronic packaging. Existing methods face challenges such as high barriers to traditional finite element (FE) simulation, low efficiency, and poor reusability, while purely data-driven models suffer from issues like the...