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Wen-Wang Zhang

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Sep 2026

Physics-Guided FE Surrogate CDNN With Grouped Attention and Monotonicity Constraints for Solder Joint Thermal Fatigue Life Prediction

The prediction of thermal fatigue life for solder joints is a key aspect of reliability design in electronic packaging. Existing methods face challenges such as high barriers to traditional finite element (FE) simulation, low efficiency, and poor reusability, while purely data-driven models suffer from issues like the...

Ya-Xian Huang, Yang Xi, Renxiang Wang et al. · 0 citations

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