Run-to-Run Control of Chemical Mechanical Polishing Head With Adjustable Partition Pressure Based on Deep Reinforcement Learning
The polishing head is one of the most important components in the chemical mechanical polishing (CMP) process, used to achieve an ultra-smooth surface on the wafer. Due to the effect of the retaining ring and the replacement of the polishing pad, the polishing process is subjected to drift and shift interference. The C...