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Yi-Min Yao

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Sep 2026

Low-Modulus Thermal Interface Materials with Bicontinuous Heat-Conduction Pathways Enabled by Liquid Metal and Graphene Films

Developing thermal interface materials (TIMs) with high thermal conductivity (k) and good mechanical compliance is critical for thermal management of high-power electronics. However, conventional polymer-based TIMs usually suffer from low intrinsic k, while the incorporation of highly conductive fillers often leads t...

Jing-Bing Yang, Qi You, Hao-Tian Tang et al. · 0 citations
Open access Aug 2026

Multi-objective and cross-scale inverse design of temperature-control materials via physics-constrained machine learning

An artificial intelligence framework that incorporates a physics-constrained inverse-design system (PHICS) built upon a directed acyclic graph (DAG) architecture for CPCMs, integrating interface, phase, and carrier engineering.

Dong-Liang Ding, Min-Hao Zou, Ruo-Yu Huang et al. · 0 citations

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