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Yu-Kun Lv

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Sep 2026

Tailoring Backbone Rigidity and Cross-Linking of Photosensitive Polyimides for 3D Printing with Ultralow Dielectric Loss at High Frequencies

Additive manufacturing represents a versatile platform for the development of high-frequency communication electronics. However, existing dielectric polymer inks often fail to simultaneously meet the requirements of low dielectric loss, high thermal stability, and high mechanical robustness. In this work, a photosens...

Yong-Quan Jiang, Chang-Hong Xiao, Bei-Bei Su et al. · 0 citations

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