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Sponsored AI Networking Cookbook: Practical recipes for AI-assisted network automation and development AI Networking Cookbook: Practical recipes for AI-assisted network automation and development

Author

Yu Zhang

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Conference Aug 2026

Machine Learning-Assisted Numerical Investigation on Multiphysics Coupling for Copper Electroplating in High-Aspect-Ratio Through-Glass Vias

Through-glass vias (TGVs) are key structures for high-density vertical interconnection in three-dimensional advanced packaging. The quality of copper electroplating filling of TGVs directly affects the electrical performance, thermal stability, and service reliability of interconnect structures. Conventional finite ele...

Wei Li, Xiao-Yue Ding, Zhao-Tian Li et al. · 0 citations

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