Zi-Qin Zhan

Mechanism-Driven Deep Learning for Predicting the Impact of Hard Impurity Particles on Direct Wafer Bonding Performance

Direct wafer bonding is a foundational technology for fabricating micro-electro-mechanical systems (MEMS) and achieving high-density multifunctional chip integration. However, the presence of environmental impurity particles at the bonding interface remains a critical challenge. While traditional evaluation methods rel...