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Design and Comprehensive Verification of a High-Throughput AXI4 Interconnect Fabric Supporting Out-of-Order Transactions and Pipeline Resilience

Aug 2026 · International Symposium on VLSI Design and Test · pp. 98-103 · 0 citations · 9 references

Abstract

Currently, as System-on-Chip (SoC) archiStectures scale in complexity, it is necessary to have an efficient communication between the components and also the demand for highthroughput, latency-tolerant memory interconnects has become critical. This paper presents the design, implementation and comprehensive functional verification of a scalable AXI4 interconnect fabric, with a primary focus on pipeline resilience under heavy bus congestion, keeping all other important features intact. A rigorous, multi-scenario stress-testing methodology is employed to validate the architectural limits of the protocol across complex routing conditions. Successful execution of advanced protocol features, including Out-of-Order (OoO) transaction completion, multi-slave address decoding, and full-duplex pipelined execution shows the deep analysis carried out. Key functional validations demonstrate dynamic byte-lane management during narrow transfers, precise internal arithmetic for WRAP burst boundaries, and independent channel synchronization during asynchronous wait-state injections. Furthermore, the control logic is verified against severe edge cases, including explicit Slave Error (SLVERR) exception handling and sustained backpressure, without suffering head-of-line blocking or data corruption. The resulting waveform analysis from Xilinx Vivado 2023.2 definitively proves protocol compliant implementation, establishing a verified, fault-tolerant framework for integrating non-blocking AXI4 topologies into high-performance SoC environments.

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