Thermal management limits the performance of densely integrated electronics. Heat-sink surfaces are conventionally passive elements dedicated to heat rejection. Here we show that one conformal single-walled carbon nanotube (SWCNT) coating renders such a surface dual-functional. The coating comprises p- and n-type SWCNT films whose porous, mesh-like network enlarges the effective surface area and raises the emissivity. It converts part of the rejected heat into electricity through the Seebeck effect. We applied the coating to an alumite-insulated aluminum screw, a compact model of an extended heat-sink surface. Under forced convection at 3.0 m/s, the coating lowered the hot-side temperature of the screw by up to 22 K, from 341.8 K to 319.4 K. Cooling was optimal at 75% axial coverage. Repeated runs and an independently fabricated device confirmed this optimum. The apparent heat-transfer coefficient, defined on the total heater input and on the metallic reference area, rose 1.6-fold, from 172 to 278 W/(m2·K). At full coverage, the same layer generated 0.72 mV and 1.0 nW per p–n pair. The cooling optimum and the power optimum occur at different coverages, which yields a practical design freedom. These results recast the surfaces of cooling components as multifunctional, thermally active layers.
Battery packaging capable of autonomous temperature regulation is a highly attractive strategy for thermal management systems, as it directly enhances safety by mitigating thermal runaway risks. In this work, an integrated battery packaging film capable of simultaneous heat dissipation, low-temperature heating, and rea...
High-power electronic systems increasingly require thermal management solutions that combine superior heat transport with application-specific cooling geometries. This work presents a manufacturing concept for producing complex Cu-diamond heat sinks with thermal conductivities up to 650 W|(m·K). The approach combines a...
T. Hutsch, S. Riecker, Kay Reuter et al.· Euro PM2026 Proceedings· 0 citations
Thermal interface materials (TIMs) are indispensable in electronic thermal management, as they mitigate interfacial thermal resistance and improve heat transport efficiency between adjacent components. A major factor hindering the thermal performance of conventional TIMs is the substantial interfacial thermal resistanc...
The relentless miniaturization of electronic devices, together with the steep growth in transistor density and switching power, has pushed volumetric heat generation in modern chips, power modules, light-emitting diodes (LEDs), photovoltaic concentrators, and battery packs to levels at which conventional air cooling is...
Parimal Chaudhari, Shaival R. Parikh, Sunil Dohare et al.· Energies· 0 citations
Electric vehicles (EVs) lack a substantial source of recoverable powertrain waste heat, making cabin heating a direct parasitic load on the battery and thereby increasing the need for efficient and spatially distributed thermal management strategies. In this study, a flexible self-regulating surface heater was develope...
Thermal interface materials used in high-power electronic devices must combine efficient heat transfer with mechanical flexibility and suitable thermal stability. However, constructing continuous in-plane and through-plane heat-conduction pathways at low filler loadings while preserving mechanical properties remains ch...
Guo-Jun Cheng, Ming Yan, Ya-Ling Zhang et al.· Coatings· 0 citations
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