Laser printing: a scalable, solvent-free manufacturing platform for flexible optoelectronics

Abstract

Laser printing offers a scalable, low-cost, and solvent-free alternative to traditional manufacturing of optoelectronic devices; it is compatible with flexible substrates and eliminates the hazardous solvents typically required in solution-based processing. We demonstrate this technique for the deposition and patterning of organic semiconductors and perovskite films. These films printed on flexible substrates exhibit charge carrier mobilities comparable to solution-processed films and high tolerance to bending. The films have been subjected to various stress tests and demonstrated exceptional resilience under extreme environments including radiation doses exceeding 200 Gy, 90% relative humidity, and significant thermal stress. This enhanced stability is attributed to a unique film formation mechanism and defect-tolerant microstructure, with the non-perovskite toner components providing in-situ encapsulation. Such resilience suggests significant potential for applications in photovoltaics, space exploration, and satellite technology. While these characteristics are promising, improving film uniformity remains the primary challenge for the widespread adoption of this technology.