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Sponsored AI Networking Cookbook: Practical recipes for AI-assisted network automation and development AI Networking Cookbook: Practical recipes for AI-assisted network automation and development

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Aug 2026

Low-Thermal-Dissipation PDMS Package for Surface Acoustic Wave-Based Microfluidic Lab-on-Chip Devices

The integration of polydimethylsiloxane (PDMS) microstructures with surface acoustic wave (SAW) devices requires controlled mechanical attachment to piezoelectric substrates, as mechanical boundary conditions directly influence the heating rate through acoustothermal energy dissipation. In this work, we propose a novel...

J. M. Rocha, S. Balashov, I. A. Pereira et al. · 0 citations
Open access Sep 2026

Experimental investigation and modelling on the water ingress protection of laser-structured glass-micromesh chips with cloverleaf-like microstructures

Glass-micromesh chips, produced by a laser-induced deep etching (LIDE) technique, have recently been demonstrated as promising environmental protective components for microelectromechanical system (MEMS)-based microphones, exhibiting minimal adverse impact on their acoustic characteristics and a high capability to filt...

Giovanni Acanfora, Seamus Lilley, F. Oktasendra et al. · 1 citation
Open access Sep 2026

Non-Contact Evaluation of Film Electroadhesion using Laser Ultrasonics and SAWs

Film adhesion is a critical phenomenon that has been thoroughly investigated to improve structural reliability, notably in microelectronics. In this work, Laser Ultrasonics is used to evaluate the bond quality achieved by an original electroadhesion process. More precisely, an electrostatic field is applied to a polyvi...

Meriem Chrifi Alaoui, M. Baher, F. Jenot et al. · 0 citations
Sep 2026

Plasma behaviors and welding property control in non-optical contact metal-glass laser welding.

Reliable femtosecond laser bonding of glass and metal is urgently required for extreme-service optical components, yet severe thermal expansion mismatch and roughness-induced interfacial air gaps severely degrade joint performance. This work systematically investigates plasma behaviors and welding property control in m...

Yin-Zhi Fu, Dong-Han Li, Jin-Lin Luo et al. · 0 citations
Open access Oct 2026

Angled glass micromachining with a 6DOF spark-assisted chemical engraving system: Error characterization and tool-angle compensation

As a common engineering material, glass possesses several unique properties that make it promising for micro-electro-mechanical systems (MEMS). However, micromachining glass structures is demanding because its hardness and brittleness challenge conventional manufacturing methods. Spark-assisted chemical engraving (SA...

Zhao Zheng, R. Wüthrich · 0 citations
Open access Sep 2026

Gas-permeable and stretchable nanoscale anisotropic conductive film for room-temperature, pressure-free interconnections

As stretchable electronics advance in functionality and application scope, interconnection technologies have become critical. Devices in wearable and soft-robotic systems require thinness, stretchability, gas permeability, and damage-free bonding conditions. Accordingly, interconnection technologies must exhibit simila...

Shumpei Katayama, Lu-Lu Sun, Tomoki Shigehara et al. · 0 citations

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